Jawatan Kosong Package Failure Analysis Intern Kulim September 2019 at Intel. Good Morning to friend being need. I hope not stop to find suitable employment suitable to your interest . Indeed, sometimes find matching jobs is not easy in 2019. On this occasion the admin will give information Jawatan Kosong Package Failure Analysis Intern Kulim September 2019 at Intel. The following is more info about Jawatan Kosong Package Failure Analysis Intern Kulim, September 2019 Intel.
Jawatan Kosong Package Failure Analysis Intern Kulim September 2019 Intel
The following is requirements you must meet to filling Jawatan Kosong Package Failure Analysis Intern Kulim September 2019 Intel which opened in month September 2019 :
In this position, you will be responsible for identifying and researching component failures to improve yield, quality and/or reliability. Your responsibilities will include but not be limited to:
Perform electrical validation and fault isolation to products that failed test and finding the physical defects that associate with the electrical failure. Be able to clearly comment about the failure mode and mechanism.
Proficient in using analytical tools such as Parametric Analyzer (I/V analysis), Keithley meter, LCCT, TDR, EOTPR, SEM/EDX, Acoustic Scanner, X-Ray, FIB, FTIR and others.
Using sample preparation tools such as Mechanical Polisher, DNC miller, Chemical Etching to reveal the defect or failure.
Publishing analytical reports with established failure mode and failure mechanism.
Pursuing degree in Chemical/Material/Mechanical Engineering or equivalent
Positive attitude, disciplined and able to work in stressful and highly competitive environment.
Proficiency in using analytical tools such as Microscope, DNC miller, Chemical Etching, Scanning Electron Microscopy, possessing Chemistry and/or Metallurgy knowledge is a plus;
Good analytical mind to interpret results and provide summary/conclusion to lab analysis performed.
Good knowledge in polymers, chemistry and metallurgy
Very dedicated and highly productive person who is able to deliver analysis result to the customers within very challenging timeline.
Able to do internship for at least 10 weeks onwards
Oct 30, 2015
As the world's largest chip manufacturer, strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
N/AOnly candidates who meet the above terms that will be notified upon to carry out further tests. Therefore if you are interested and meet requirements of participant Jawatan Kosong Package Failure Analysis Intern Kulim September 2019 Intel above, please send your application before vacancies closed.
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